Specifications

  • Category: Inorganic and Isotopic Mass Spectrometry
  • Technique: SIMS
  • Manufacturer: IONTOF
  • Country: Germany
  • Available: Inactive
All specifications

About

Short description

Retired Time-of-Flight Secondary Ion Mass Spectromete for ultra-high-resolution surface analysis. Capable of detailed 3D imaging, depth profiling, and molecular/elemental analysis of surfaces with high spatial and depth resolutions.

Specifications

Retired Time-of-Flight Secondary Ion Mass Spectromete for ultra-high-resolution surface analysis. Capable of detailed 3D imaging, depth profiling, and molecular/elemental analysis of surfaces with high spatial and depth resolutions.

  • Status: Inactive
  • Country: Germany
  • Isotopic: Yes
  • Elemental: Yes
  • Analyte Type / Target Of Analysis: Most of elements, isotopes, and molecular species
  • Measurable Isotopes/Elements: Isotopes of elements across the periodic table
  • Analyzer Type
    : Time-of-Flight MS
  • Ion Source Type: Liquid Metal Ion Gun (Bi+), dual ion sources (Cs+ and O2+)
  • Inlet Types: Ultra-high vacuum chamber with motorized sample stages
  • High Resolution
    : Yes
  • Mass Resolution/ Mass Resolving Power
    : R>10,000
  • Sensitivity
    : High sensitivity for molecular and elemental analysis at ppm/ppb levels
  • Detection Limits
    : Down to 107 atoms/cm
  • Detector Type
    : Microchannel plate detector with phosphor screen and time-to-digital converter
  • Possible Amplifiers
    : Bi+, Cs+, O2+, and C60+
  • Primary Beam [SIMS]
    : Primary beam energy up to 30 keV
  • Voltage
    : Optional post-ionization available
  • Spatial Resolution
    : <60 nm
  • Depth Profile
    : Depth resolution better than 1 nm
  • Beam Energy
    : Bi+: 25 keV; Cs+/O2+: up to 2 keV
  • Camera
    : High-resolution CCD camera for sample navigation
  • Geometry Type
    : Single-focusing reflectron energy compensating TOF geometry
  • Focusing Type
    : Electrostatic focusing for high resolution
  • Gas Supply: Cs, O2, and inert gases for sputtering
  • Power Specifications: 210–230 V, 50/60 Hz; Max power: 3.5 kW
  • Environmental Specifications: Temperature: 18–22°C; Humidity: 20–80%
  • Physical Specifications: Main unit: 930 × 1820 × 2050 mm; Weight: 900 kg; Electronics rack: 1650 × 1730 × 757 mm; Weight: 300 kg

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