AmberX

Xe plasma FIB and field-free UHR-SEM for large-scale, Ga-free, multimodal analysis

• Status: Active
• Country: Czechia
• Techniques: SEM, FIB
• Analyte Type / Target Of Analysis: Morphology and microstructure
• Vibration / Magnetic / Noise Tolerance
  : <10 µm/s <30 Hz; <20 µm/s >30 Hz; <60 dBC; <300 nT sync field
• Electron Gun Type
  : Schottky FEG
• Standard Detectors [EM]
  : In-column SE and BSE, chamber-mounted SE and BSE
• Optional Detectors [EM]: EDS, EBSD, WDS, TOF-SIMS, Raman, Rocking Stage, Rainbow CL
• Cryo
  : Optional
• STEM
  : Yes
• STEM Parameters: STEM resolution: 0.8 nm @ 30 keV; EBSD-optimized with Rocking Stage
• Additional Analytical Capabilities
  : EDS, EBSD, WDS, TOF-SIMS, Rocking Stage, microanalysis, multi-modal tomography
• Electron Optics
  : BrightBeam UHR-SEM with field-free column, large FOV and In-Flight Beam Tracing
• Resolution [EM]
  : 0.8 nm @ 30 keV STEM; 0.9 nm @ 15 keV; 1.5 nm @ 1 keV; 1.3 nm @ 1 keV (BDM)
• Optical Column
  : BrightBeam field-free column, In-Flight Beam Tracing, optimized for EBSD/EDS
• Electron Beam Resolution
  : 0.8–1.5 nm depending on mode; STEM: 0.8 nm @ 30 keV
• Beam Current
  : Up to 400 nA
• Image Parameters
  : 16k × 16k, overview and WideField modes, 50 mm FOV
• Magnification
  : Max FOV: 50 mm @ WD = 70 mm
• Chamber
  : 340 mm W × 315 mm D, 20+ ports, active suspension, includes extensions for 6", 8", 12" wafers and Raman integration
• Camera Details
  : Dual IR cameras, live chamber view, integrated overview imaging
• Stage Parameters
  : 5-axis compucentric; X/Y: 130 mm, Z: 90 mm, Tilt: –60° to +90°, supports large sample volume navigation
• Holder Types: STEM holders (up to 8 grids), lamella, mechanical tests, EBSD cradle plus high-volume prep with Rocking Stage for curtaining reduction
• Sample Size: Max height 90 mm (132 mm w/o rotation), large wafer extensions; optimized for large cross-sections (1 mm width)
• Aberration Correction Type
  : Beam deceleration optimization for high current EBSD
• Cooling System
  : -; supports stable low-kV ops
• Vacuum System
  : High vacuum <9×10⁻³ Pa; low vacuum 7–500 Pa; all oil-free
• Power Specifications: 231 V ±10%, 50 Hz, 2300 VA, 2 kW UPS included
• Environmental Specifications: 17–24 °C, <65% RH, <10 µm/s vibration, <60 dBC, magnetic <300 nT
• Physical Specifications: Footprint: minimum 4.2 × 3.1 m; door width ≥1.0 m